Polydimethylsiloxane/Glass-Based Composite Elastomer for Thermophysical Applications
Abstract
The possibility of reducing the thermal conductivity of the composite material based on polydimethylsiloxane by adding hollow glass microspheres as fillers was tested. Based on the data obtained, it can be concluded that a composite material containing microspheres at a concentration of 2.5% has a lower thermal conductivity coefficient by 40%, but also loses adhesion work and transparency in the optical range.
Keywords
Thermal conductivity; Microspheres; Adhesion; Polydimethylsiloxane; Composite materialFoundings
Ministry of Science and Higher Education of the Russian Federation: project No. 07515-2021-1349
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